OAK 4 FFC

Build the camera setup your machine needs. OAK 4 FFC combines the OAK 4 SoM with a compact carrier board and flexible camera connections, so sensors can be positioned around your own enclosure, robot, or inspection system. Multiple viewpoints share one compute platform, while DepthAI provides the tools for image processing, stereo depth, synchronization, stitching, and neural-network inference.

Choose a preassembled Developer Kit to start evaluating, or the Barebone configuration when integrating the board into your own mechanical design. Camera modules are selected separately to suit the required resolution, shutter type, and field of view.

RVC4 On-board Features

• CPU: 6-core ARM processor running Luxonis OS
• Memory: 8GB RAM and 128GB onboard storage
• AI accelerator: 48 TOPS INT8 / 12 TOPS FP16
• GPU: 4 TOPS FP16
• Vision processing: stereo depth with filtering and RGB-depth alignment, image transformation, feature tracking, and neural-network inference through DepthAI
• Camera interface: five MIPI CSI camera connections via FFC

The board provides five physical camera ports. Supported concurrent streams, resolutions, frame rates, and processing features depend on the sensors, firmware, and DepthAI pipeline. Camera placement, optics, and baseline determine the depth range and calibration requirements.

Compatible Camera Modules

OAK 4 FFC uses supported OAK-FFC V2 camera modules. The launch lineup covers:

• IMX586: 48MP color, rolling shutter, with standard (non-wide) and wide-FOV versions; focus options vary by module
• OV9282: 1MP monochrome, global shutter, with standard (non-wide) and wide-FOV versions
• OG05: 5MP global shutter, with color and monochrome options in standard (non-wide) and wide-FOV versions

Focus and field-of-view options vary by module. Select modules specified for OAK 4 FFC; compatibility should not be assumed for other FFC cameras. Camera modules are sold separately.

Coming Q1 2027

Planned additions to the OAK 4 FFC module lineup:

• Time-of-Flight (ToF) modules
• Thermal modules
• Additional global-shutter sensors

These are upcoming options, separate from the launch camera lineup. Module specifications and ordering details will be added when available.

Software, Stereo Depth, and Calibration

Build vision pipelines with DepthAI v3 in Python or C++ and run them on the included OAK 4 SoM. The Linux-based Luxonis OS supports standalone application deployment. OAK Viewer provides a way to inspect camera streams and evaluate supported pipeline configurations.

For stereo depth, choose a supported camera pair and a baseline suited to the working distance. There is no single fixed depth range or accuracy figure for this board: optics, baseline, resolution, lighting, scene texture, and calibration all affect the result.

Calibrating Your Camera Rig

Launch OAK-FFC V2 modules ship with factory-calibrated camera intrinsics. The assembled rig still needs calibration for the placement and orientation of its cameras. Use the OAK 4 FFC workflow in OAK Viewer to enter the measured baselines and run Dynamic Calibration.

For supported factory-calibrated modules, Dynamic Calibration uses natural scenes without a printed ChArUco target. Repeat rig calibration after changing the baseline, replacing a camera module, or remounting the cameras. Validate calibration quality and depth performance for the final installation.

Use the production-approved combination of Luxonis OS, DepthAI, and OAK Viewer for your board revision. See the OAK 4 FFC Getting Started Guide in Files.

Connectivity and Expansion

Camera Connections

Connect supported OAK-FFC V2 modules to the five FFC ports and position them to suit your machine. Choose overlapping views for stereo depth or separate viewpoints for multi-camera perception. Resolution, frame rate, synchronization, and image-processing support depend on the selected sensors, port configuration, and software release.

FFC orientation and the port pinout matter. Use the correct cable and connector orientation for each port, and disconnect power before connecting or changing camera modules.

Ethernet and USB

• Ethernet: up to 2.5Gbps. The Developer Kit uses an 8-pin M12 panel-mount connector. The Barebone board exposes Ethernet through a Hirose DF50A-10P-1H(51) connector. Achievable throughput depends on the cable, switch, and host/network interface.
• USB-C: up to 5Gbps, with host and device operation. Use a USB 3 data cable and a sufficiently powered USB-C PD source when USB supplies both power and data.
• Separate power and data: PoE+ can power the board while USB provides a direct data connection. Ethernet can also carry data when the board is powered through USB-C or its DC input.
• Standalone or connected development: deploy the application to the onboard Linux system, or keep a computer connected while developing and inspecting streams with DepthAI and OAK Viewer.

Auxiliary I/O and Board-Level Interfaces

The Developer Kit exposes auxiliary I/O on an 8-pin M8 connector. On the Barebone board, the auxiliary connection is Hirose DF50A-8P-1H(51). The interface provides debug UART or GPIO, FSYNC/STROBE signals, USB 2.0 host connectivity, and a 5V auxiliary power output, subject to the supported hardware revision and software configuration.

Expansion headers expose configurable SPI, I2C, UART, GPIO, and I2S functions. A separate connector provides the CAN interface, and the board includes an SD card slot and a reset-button connection. Pin multiplexing, voltage levels, and available functions must be checked against the release-specific pinout before connecting peripherals.

Power Requirements and Power Budget

Power Input Options

• DC input: 6–32V DC. The Developer Kit uses a 4-pin M8 DC connector; the Barebone board uses a Hirose DF50A-4P-1H(51) connector. Use a supply and wiring appropriate to the complete camera and compute load.
• USB-C Power Delivery: 15W minimum; 30W recommended. A 15–20W source runs the OAK4 platform at reduced performance. A USB-A port alone is not an adequate power source.
• PoE+: IEEE 802.3at through the PoE module, with up to 25W available at the device. Use a compliant 30W PoE+ injector or switch. The PoE+ module is included in the Developer Kit; for Barebone integration, contact us.

Compute and Peripheral Power

The specified peak compute power budget is 25W without USB/M8 accessories, or 20W when 5W is allocated to those accessories. The auxiliary output is 5V at 1A (5W maximum), and USB-C can supply up to 5W in source mode. Peripheral power comes from the same system budget; it is not additional compute capacity.

Peak power is not a guaranteed continuous operating point. Actual consumption and sustained performance depend on the camera configuration, frame rates, AI and stereo workloads, attached peripherals, input supply, ambient temperature, and cooling. Allow for peak demand when sizing the supply and validate sustained workloads in the final assembly.

Integration and Operating Conditions

Mounting and Thermal Design

The carrier board measures 70 × 53mm, with four M3-sized mounting holes. The Barebone assembly weighs 36g. The Developer Kit weighs 215g without packaging and includes a passive heatsink, thermal interface material, L-bracket, and mounting hardware. Barebone installations require an application-specific heatsink or a suitable thermal path into the enclosure.

The specified operating temperature range is −20°C to 50°C with appropriate thermal management. Keep airflow around the heatsink unobstructed and validate cooling under the intended sustained workload. Mechanical drawings and mounting-hole locations will be linked in Files.

Integration and Enclosure

OAK 4 FFC is an embedded board platform supplied without a sealed enclosure. The panel-mount connector set supports integration into a suitable IP67 enclosure when installed and sealed correctly. The finished system's ingress protection, thermal design, and end-product certification are the integrator's responsibility.

The connector installation torque specified for the panel-mount set is 0.784 N·m for M12 and 0.588 N·m for M8. Follow the final assembly drawing and sealing instructions for the selected connector set.

Status and Diagnostics

The user-programmable status LED also indicates device and OS state: blinking blue for device setup, solid blue for ready, and a red flash on startup for a potential power-compatibility issue. A reset button and connection for an external reset button support integration and recovery.

Compliance

Use the OAK 4 FFC production compliance documents for design-in review. Certifications and export classifications from other OAK or FFC products do not establish compliance for this board or the finished system.

OAK 4 FFC production product diagram: [link pending]

OAK 4 FFC Developer Kit

A preassembled configuration for development and evaluation:

• OAK 4 FFC carrier board with OAK 4 SoM
• PoE+ module
• Panel-mount connector set for Ethernet, auxiliary I/O, and DC power
• Passive heatsink and thermal interface material
• L-bracket and mounting hardware
• M12-to-RJ45 cable
• FFC cable helper tool
  
• Screwdriver

OAK 4 FFC Barebone

A compact configuration for integration into your own system:

• OAK 4 FFC carrier board with OAK 4 SoM
• Thermal interface material and mounting screws

The Barebone configuration requires your own cooling and cabling appropriate to the application. Connector specifications are in the Getting Started Guide, so you can build your own cables. For a preassembled connector set or PoE+ module, contact us.

Camera modules are not included with either configuration and must be selected separately.

OAK 4 FFC Datasheet (PDF)

Open-Source Reference Design

The OAK 4 FFC carrier and PoE board designs are open source. Use them as a starting point for your own carrier board around the OAK 4 SoM.

• OAK 4 FFC design files on GitHub
• Carrier board schematic (PDF)
• PoE board schematic (PDF)
• Carrier board Altium project (PCB, schematics, fabrication and assembly outputs)
• PoE board Altium project
• OAK 4 SoM connector libraries (Altium symbols and footprints)
• OAK 4 SoM datasheet (pinouts, electrical limits and mechanical drawings)

[PENDING: 3D CAD/STEP models and dimension drawings, mounting-hole and panel cutout drawings, compliance documents]

Getting Started Guide

OAK 4 FFC Getting Started Guide